MarketResearchNest.com
adds “Global Chip On Flex (COF) Market
Growth 2019-2024”new report to its research database.
Chip-on-Flex, or COF, refers to the semiconductor assembly
technology wherein the microchip or die is directly mounted on and electrically
connected to a flexible circuit (a circuit built on a flexible substrate instead
of the usual printed circuit board). Thus, in a COF assembly, the microchip
doesn't have to go through all the traditional assembly steps required for
individual IC packaging. This simplifies the over-all process of designing and
manufacturing the final product while improving its performance as a result of
the shorter interconnection paths.
COF is the role of product through the flexible substrate
and connected to on-chip liquid crystal panel, the liquid crystal panel and the
control chip driver current, voltage, thus changing the state of the liquid
crystal display different screens. Currently, COF products are widely used in
LCD TVs, smart 3G phones and laptop computers and other products with LCD
display driver.
Driven by a growing range of applications in the automotive,
industrial, military, aerospace, computer, telecommunication, consumer
electronics, and medical electronics industries, miniaturization and the use of
flex circuits continue to be of prime interest to electronics manufacturers.
In China, COF manufactures mainly include Danbond
Technology, AKM Industrial, Compass Technology Company and others. China is the
world's third producer of COF and the world's biggest consumption market.
According to this study, over the next five years the Chip
On Flex (COF) market will register a 4.4% CAGR in terms of revenue, the global
market size will reach US$ 1850 million by 2024, from US$ 1490 million in 2019.
In particular, this report presents the global market share (sales and revenue)
of key companies in Chip On Flex (COF) business, shared in Chapter 3.
This report presents a comprehensive overview, market
shares, and growth opportunities of Chip On Flex (COF) market by product type,
application, key manufacturers and key regions and countries.
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This study considers
the Chip On Flex (COF) value and volume generated from the sales of the
following segments:
Segmentation by
product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to
2024 in section 11.7.
·
Single
sided COF
·
Others
Segmentation by
application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to
2024 in section 11.8.
·
Military
·
Medical
·
Aerospace
·
Electronics
·
Other
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contents and data tables @
Splits the market by
region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas, United States, Canada, Mexico, Brazil, APAC,
China, Japan, Korea, Southeast Asia, India, Australia, Europe, Germany, France,
UK, Italy, Russia, Spain, Middle East and Africa, Egypt, South Africa, Israel,
Turkey, GCC Countries
The report also
presents the market competition landscape and a corresponding detailed analysis
of the major vendor/manufacturers in the market. The key manufacturers covered
in this report: Breakdown data in in Chapter 3.
·
LGIT
·
Stemco
·
Flexceed
·
Chipbond Technology
·
CWE
·
Danbond Technology
·
AKM Industrial
·
Compass Technology Company
·
Compunetics
·
STARS Microelectronics
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In addition, this report discusses the key drivers
influencing market growth, opportunities, the challenges and the risks faced by
key manufacturers and the market as a whole. It also analyzes key emerging
trends and their impact on present and future development.
Research objectives
·
To study and analyze the global Chip On Flex
(COF) consumption (value and volume) by key regions/countries, product type and
application, history data from 2014 to 2018, and forecast to 2024.
·
To understand the structure of Chip On Flex
(COF) market by identifying its various subsegments.
·
Focuses on the key global Chip On Flex (COF)
manufacturers, to define, describe and analyze the sales volume, value, market
share, market competition landscape, SWOT analysis and development plans in
next few years.
·
To analyze the Chip On Flex (COF) with respect
to individual growth trends, future prospects, and their contribution to the
total market.
·
To share detailed information about the key
factors influencing the growth of the market (growth potential, opportunities,
drivers, industry-specific challenges and risks).
·
To project the consumption of Chip On Flex (COF)
submarkets, with respect to key regions (along with their respective key
countries).
·
To analyze competitive developments such as
expansions, agreements, new product launches, and acquisitions in the market.
·
To strategically profile the key players and
comprehensively analyze their growth strategies.
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