MarketResearchNest.com
adds “Global IC-Substrate Market Growth
2019-2024”new report to its research database.
This report studies the IC-Substrate market, IC substrate is
a type of carry material for integrated circuit with internal circuit to
connect the chips and PCBs. Additionally, the IC substrate can protect the
circuit, special line, it is designed for heat dissipation and acts standardized
module of IC components. It is one of the most key materials of the IC
packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
IC substrate is a type of carry material for integrated
circuit with internal circuit to connect the chips and PCBs. Including Rigid
Substrate, Flexible Substrate, Ceramic Substrates by Materials, and WB (wire
bonding), FC (flip chip) IC-Substrate by packaging method. The IC-Substrate is
mainly used for PC (Tablet, Laptop), Smart Phone, Wearable Devices and Other
Devices. And PC (Tablet, Laptop) is the largest usage with the share of about
48%, followed by Smart Phone (35.5%).
The global average price of IC-Substrate is in the declining
trend in 2012-2017, from about 817 $/m²in 2012 to 564 $/m² in 2016. And the
price will be in declining trend while there are more and more players come.
Taiwan, Korea, Japan and China are the four largest sales
market of IC-Substrate in the world in the past few years and it will keep the
same position in the next years. And Japan is the largest customer of
IC-Substrate in the world at present. Taiwan is the second largest market in
the report with a consumption share of about 24% in 2016, followed by China
with a share of 16%. Other key markets are Korea, USA, Europe, etc. which have
the leading technology.
According to this study, over the next five years the
IC-Substrate market will register a xx% CAGR in terms of revenue, the global
market size will reach US$ xx million by 2024, from US$ xx million in 2019. In
particular, this report presents the global market share (sales and revenue) of
key companies in IC-Substrate business, shared in Chapter 3.
This report presents a comprehensive overview, market
shares, and growth opportunities of IC-Substrate market by product type,
application, key manufacturers and key regions and countries.
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This study considers
the IC-Substrate value and volume generated from the sales of the following
segments:
Segmentation by
product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to
2024 in section 11.7.
·
WB BGA
Substrate
·
WB CSP
Substrate
·
FC BGA
Substrate
·
FC CSP
Substrate
·
Other
Types
Segmentation by
application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to
2024 in section 11.8.
·
PC
(Tablet, Laptop)
·
Smart
Phone
·
Wearable
Devices (smart watch)
·
Other
Applications
This report also
splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas, United States, Canada, Mexico, Brazil, APAC,
China, Japan, Korea, Southeast Asia, India, Australia, Europe, Germany, France,
UK, Italy, Russia, Spain, Middle East and Africa, Egypt,South Africa, Israel,
Turkey, GCC Countries
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contents and data tables @
The report also
presents the market competition landscape and a corresponding detailed analysis
of the major vendor/manufacturers in the market. The key manufacturers covered
in this report: Breakdown data in in Chapter 3.
·
Ibiden
·
Shinko
·
Kyocera
·
Eastern
·
TTM Technologies
·
Unimicron
·
Kinsus
·
Nanya
·
ASE
·
Semco
·
LG Innotek
·
Simmtech
·
Daeduck
·
KCC（Korea Circuit Company）
·
Zhen Ding Technology
·
ATandS
·
Shennan Circuit
·
ACCESS
·
Shenzhen Fastprint Circuit Tech
In addition, this
report discusses the key drivers influencing market growth, opportunities, the
challenges and the risks faced by key manufacturers and the market as a whole.
It also analyzes key emerging trends and their impact on present and future
development.
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Research objectives
·
To study and analyze the global IC-Substrate consumption (value and
volume) by key regions/countries, product type and application, history data
from 2014 to 2018, and forecast to 2024.
·
To understand the structure of IC-Substrate market by identifying its
various subsegments.
·
Focuses on the key global IC-Substrate manufacturers, to define, describe and analyze the
sales volume, value, market share, market competition landscape, SWOT analysis
and development plans in next few years.
·
To analyze the IC-Substrate with respect to individual growth trends, future
prospects, and their contribution to the total market.
·
To share detailed information about the key
factors influencing the growth of the market (growth potential, opportunities,
drivers, industry-specific challenges and risks).
·
To project the consumption of IC-Substrate submarkets, with respect
to key regions (along with their respective key countries).
·
To analyze competitive developments such as
expansions, agreements, new product launches, and acquisitions in the market.
·
To strategically profile the key players and
comprehensively analyze their growth strategies.
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